| 摘要 |
PROBLEM TO BE SOLVED: To prevent the connection reliability of a semiconductor device to an external electric circuit from being lowered due to break of a low temperature fusing brazing metal for connecting the connecting pad of a wiring board and the external electric circuit. SOLUTION: Concerning the wiring board composed of an insulating substrate 1, which is composed of an electric insulating material, having a semiconductor device mounting part 1a on the surface, a lot of circular connecting pads 6 formed on the lower surface of this insulating substrate 1 and a plurality of wiring conductors 2 derived from the said mounting part 1a of the said insulating substrate 1 to the said connecting pads 6, each of said connecting pads 6 is composed of a membrane conductor layer having a diameter less than 0.35 mm, and an annular interval part 6b is formed close to the outer periphery thereof. |
