| 摘要 |
PROBLEM TO BE SOLVED: To provide an insulation resin composition for printed-wiring boards with improved heat resistance and reliability by a non-halogen-family fire- resistance resin. SOLUTION: The insulation resin composition for printed-wiring boards contains an epoxy resin that does not contain any halogen elements, an epoxy resin curing agent, an electrical insulation whisker, and metal hydroxide as essential constituents. In the insulation material with copper clad, the insulation resin composition for printed-wiring boards is laminated onto the copper foil. |
