| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink having superior radiation capability. SOLUTION: A heat sink 60 dissipates heat emitted by a CPU 43 which is secured to a socket 46 on a mother board in a housing of a personal computer. The heat sink consists of an aluminum radiation board 61 one side of which is provided with a flat heat receiver in contact with the CPU 43 and several heat sink fins 62 integrated with the other side of the heat sink board 61 as though they were cut and erected. The thickness of the heat sink board 61 should be 3 to 8 mm. The height (from the base to the top) of each of the heat sink fins 62 should be 15 to 35 mm. The wall thickness of each of the heat sink fins 62 should be 0.2 to 0.7 mm. The fin-to-fin pitch of the heat sink fins 62 should be 1.5 to 2.5 mm. A cooling fan 69 is installed above the heat sink fins 62. |
