| 摘要 |
PROBLEM TO BE SOLVED: To improve mechanical reliability of a bump junction by blocking the formation of a weak inter-metal compound composed of tin, gold and nickel by bonding zinc, which is concentrated on the surface of a solder ball, with the nickel plating when using tin/zinc solder. SOLUTION: By using a solder ball composed of solder alloy, which contains zinc, with tin as a substrate in place of tin/zinc solder constituting a conventional solder bump, a zinc layer concentrated on the surface of the solder ball is related to all junctions and blocks the reaction of tin, which forms the weak inter-metal compound. |
