| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing device for a multilayer interconnection board which allows easy and automatic alignment of the interconnection board with accuracy as well as welding interconnection board to a prepreg. SOLUTION: A rough alignment part 4 is provided where a plurality of lower-side interconnection boards provided side by side, a prepreg stacked across the upper surfaces of the plurality of lower-side interconnection boards, and a plurality of upper-side interconnection boards provided side by side over the prepreg at positions corresponding to the lower-side interconnection boards are set in stacked state. An alignment part 5 is provided where the upper-side interconnection board is aligned with the lower-side interconnection board, related to the lower-side interconnection board and upper-side interconnection board corresponding to each other. A welding part 6 is provided where each of lower-side interconnection boards and each of upper-side interconnection boards are locally heated so that they are locally welded to the prepreg for temporary bonding. |
