发明名称 BOARD INSPECTING DEVICE, BOARD MANUFACTURING METHOD, AND BOARD WITH BUMP
摘要 PROBLEM TO BE SOLVED: To provide a board inspecting device which inspects the electric resistance value, etc., of a wiring net on a printed wiring board such as a board with bumps, etc., with high precision and with general versatility, to provide a high-quality board product having a precise wiring net formed by using the inspecting device, and to provide a manufacturing method for the board. SOLUTION: In a resistance value inspecting device 1, a plurality of first terminal portions are arrayed and formed two-dimensionally on the rear of a board body 14, and solder bumps 6 are arrayed and formed two-dimensionally on the board surface as second terminal portions which correspond to the first terminal portions. A group of first measuring probes 13 is brought into contact with the group of first terminal portions. Besides, a second measuring probe 42 is brought into contact with a second terminal portion which correspond to a wiring net being an object of measurement selectively in such a way as to be attachable or detachable freely. It becomes possible to perform resistance measurement of the wiring net by a so-called four-terminal method, etc., on the basis of the level of voltage applied to the wiring net to be measured, causing measuring current to flow in the wiring net under that condition of contact. Accordingly, influence of contact resistance is excluded, and the specific electric resistance value of the wiring net can be grasped accurately, and consequently, a wiring net which is abnormal can be indentified precisely.
申请公布号 JP2001153909(A) 申请公布日期 2001.06.08
申请号 JP19990333415 申请日期 1999.11.24
申请人 NGK SPARK PLUG CO LTD 发明人 SATO HIDEO
分类号 H05K3/00;G01R1/073;G01R27/02;G01R31/02;(IPC1-7):G01R31/02 主分类号 H05K3/00
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