| 摘要 |
PROBLEM TO BE SOLVED: To enhance connection stability with the outside by reducing the size and cost of a tape carrier for loading semiconductor elements and a package which have no device holes. SOLUTION: A tape carrier and a package, which cover the whole of one face of an IC chip 1 and have the connection terminal of the IC chip 1 and a wiring pattern 4 to be connected with outside, are so constituted that the so-called 'base film' is peeled to expose the wiring pattern 4 to the opposite side of a face, where the IC chip 1 is connected. This enables mounting on both faces of a tape carrier and a package, so that the size and cost of the tape carrier and the package can be reduced. |
