| 摘要 |
PROBLEM TO BE SOLVED: To improve collect changing frequency. SOLUTION: A die bonding apparatus 21 is provided with a dismounting jig 66 engaging with a collet 40 mounted to a shank 36, and a mounting jig 69 for mounting a new collet 40A to the shank 36 from which the collet 40 was dismounted. On changing collets, the collet mounted to the shank 36 is engaged with the dismounting jig 66 at a put-down device 30 of the die bonding apparatus 21 to remove the collet 40 from the shank 36. Then the shank 36 is moved to the position of the dismounting jig 69 by the put-down device, and the new collet 40A is mounted thereto. As the collet can automatically be changed, performance of frequency for changing collets can extremely be improved, damage and contamination on the die surface by the damage and the contamination of the collet can be protected, resulting in prevention of defective die bonding due to flawaand biassed abrasion of the collet.
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