| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a device module such as an optical module and the like capable of stably mounting chips such as the optical module and the like without damages. SOLUTION: The manufacturing method of the device proceeds with mounting the chip 200 on a mount 300 by means of a transferring means 440 equipped with a chip suction unit 441 in a mounting apparatus 400A. In the method, a cushion means 500A is provided under the mount 300 mounting the chip 200 thereon, or a cushion means 500B is provided on the chip suction unit 441 of the transferring means 440 to which the chip 200 is sucked. By means of the cushion means 500A, B, impact to the chip 200 can be relieved, and the chip 200 can be stably mounted without any damages. |
