| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an electronic component package, with which the a large current is curried, reliability is satisfactory and heat resistance is small. SOLUTION: Concerning this electronic circuit package, at least one part hereof is molded with a resin using the metal base circuit substrate, with which a circuit is provided though an insulation layer except for a peripheral edge on one main side of a sheet metal, preferably, while using the said metal base circuit substrate having a lead composed of the periphery of the sheet metal.</p> |
