| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead wire superior in adhesion, the solder wetting and discoloration-proof of a plated film layer without environmental contamination, and capable of keeping these superior properties even in extruding and thinning the lead wire. SOLUTION: (1) In this lead wire for electronic parts, having a plated film layer of tin alloy on a lead wire, the plated film layer of tin alloy is a single tin alloy film layer formed by heating two layers composed of a relatively thick tin plated-layer formed directly on the conductor and a relatively thin film layer of metal excluding tin, formed on the tin plated-film layer. (2) In a lead wire for electronic parts having a plated film layer of tin alloy on a conductor, the tin alloy plated-film layer is a single tin-silver alloy film layer formed by heating two layers of a relatively thick tin plated-film layer formed directly on the conductor and a relatively thin silver film layer formed on the tin plated-film layer.
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