发明名称 |
METHOD AND APPARATUS FOR REDUCING NON-UNIFORMITY AREA EFFECTS IN THE MANUFACTURE OF SEMICONDUCTOR DEVICES |
摘要 |
The non-uniformity edge effect that can affect the quality of chips near the edge of a semiconductor wafer of various steps in the manufacture of integrated circuits is reduced. This is achieved by increasing the field area exposed by a step and repeat printer only when printing squares for chips located near the wafer edge. As a result there is also printed for processing an additional non-functional area outside the functional area to reduce the non-uniformity effect. This increases throughput of the printing apparatus.
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申请公布号 |
US2001003033(A1) |
申请公布日期 |
2001.06.07 |
申请号 |
US19990302392 |
申请日期 |
1999.04.30 |
申请人 |
SCHULZE STEFFEN;ZACH FRANZ |
发明人 |
SCHULZE STEFFEN;ZACH FRANZ |
分类号 |
G03F1/08;G03F7/20;G03F7/22;H01L21/027;H01L23/544;(IPC1-7):G03F7/20 |
主分类号 |
G03F1/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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