DEVICE FOR ENGRAVING AND INSPECTING A SEMICONDUCTOR WAFER INDENTIFICATION MARK

摘要

The engraving information such as the characters and barcodes of an engraving identification mark is inputted into a engraving device body. An identification markis engraved on a sliced wafer by a laser head. A turntable supporting the sliced wafer is rotated so that the identification mark thereof is disposed under a reading camera. The identification mark is read by the reading camera. The engraving information inputted in the engraving device body and the engraved mark read in the reading device body are compared in an information processing device. The engraving is thus controlled by the engraving device body in accordance with the compared result.