| 摘要 |
<p>The invention concerns a module comprising a metal substrate (10) based on aluminium and at least one bar (12) forming an equipotential connection made of a copper-based material, fixed to the substrate via an insulating layer. A power component (16) is in direct contact with the bar on a surface lower than that of the insulating layer. A printed circuit card (18) mounted on the bar or bars and by overlap bears the reduced heat dissipating components of the module.</p> |
