发明名称 CONDUCTOR FRAME, PRINTED CIRCUIT BOARD WITH A CONDUCTOR FRAME AND A METHOD FOR PRODUCING A CONDUCTOR FRAME
摘要 A lead frame is described which has at least one integrated electronic circuit. The integrated electronic circuit is situated in a region of a main area of the lead frame. The lead frame has at least one signal line, at least one electrically insulating plate, and an electrically conductive, grounded plate are situated. The electrically insulating plate, and the electrically conductive, grounded plate are situated, at least in sections, between the integrated electronic circuit and the signal line. A method for producing the lead frame is also described.
申请公布号 EP1104584(A1) 申请公布日期 2001.06.06
申请号 EP19990945911 申请日期 1999.07.05
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 POHL, JENS;MUFF, SIMON;MIERSCH, ECKEHARD
分类号 H01L23/367;H01L23/498;H01L23/50;H01L23/538;H01L25/065;(IPC1-7):H01L23/538 主分类号 H01L23/367
代理机构 代理人
主权项
地址