Leadframe for supporting integrated semiconductor devices

摘要

A Supporting frame (1) for electronic semiconductor devices incorporating a heat dissipator (2) and a semiconductor chip fastened on the heat dissipator (2) comprises two metal bars (3) fastened on the heat dissipator (2) by electroconductive means (4) and said bars having each a metallized area (5) lowered in relation to the top surface of the metal bar (3) designed for welding of a thin gold wire for connection with an electrical terminal of the semiconductor chip. $$ $$