MEMBER FOR MANUFACTURING SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A member for manufacturing a semiconductor package is provided to protect a conductive pattern on a film and a chip from static electricity, by forming a predetermined portion of the conductive pattern of a member as a ground region. CONSTITUTION: A film(12) of a predetermined area which has an etch-processed conductive pattern(16) on its surface, is adhered to a member(10) at regular intervals by an adhesion unit(20) in a package region penetrating a frame(18) of a metal material. A predetermined portion of the conductive pattern of the member is formed as a ground region(14) capable of discharging static electricity generated in a molding process.