RETICLE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME

摘要

PURPOSE: A reticle is provided to easily perform a planarization process regarding a substrate in a chemical mechanical polishing(CMP) process by forming a dummy pattern in an edge region of a wafer to prevent a step difference between a chip region and the edge region. CONSTITUTION: An edge region surrounds the first chip region and the second chip region. Reverse-U shape openings(20) connected to each other in a chain type are formed in the first chip region to form a dummy pattern. An opening for a pattern is formed in the second chip region.