| 摘要 |
PURPOSE: A method for manufacturing a stacked package is provided to easily stacking a plurality of layers without modifying an inside structure of the package, by inserting a flexible board into a gap between a plurality of packages, wherein the flexible board has a plurality of patterns connecting a no-connection(NC) lead with a chip select(CS) lead. CONSTITUTION: A chip pad(11a,11a') is formed in a semiconductor chip(11,11'). Pluralities of address leads have outer leads bent outside. A plurality of no-connection(NC) leads and one chip-select(CS) lead(22) are formed. The CS lead, the address lead(23) and the chip pad are interconnected with a lower wire, and a lower molding part is formed to complete a lower package(15'). A flexible board where a plurality of NC patterns and one CS pattern are formed, is adhered to the upper portion of the lower package. An upper package(15) is formed in the same method as the lower package, wherein the CS lead is short and the address lead and the NC lead are bent inside. Solder is applied to a lower end of the upper lead, and the upper lead is stacked on the flexible board so that the upper lead of the upper package and the lower lead of the lower package are combined by the solder. The flexible board is installed on the stacked upper package, and the upper package is stacked on the flexible board.
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