| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition which shows low water absorption and excellent soldering crack resistance. SOLUTION: The epoxy resin composition contains (A) a glycidyl-etherified epoxy resin obtained by mixing bisphenols F (a) with phenols (b) which is a precursor of a crystalline epoxy resin, (B) a phenol resin represented by formula (2), (C) an inorganic filler and (D) a hardening accelerator each as an essential component, wherein a weight ratio of (a) to (b) is 0.1 to 19, an equivalent ratio of a phenolic hydroxyl group of the total phenol resin to an epoxy group of the total epoxy resin is 0.5 to 2.0, the content of the inorganic filler (C) is 200 to 2,400 pts.wt. based on 100 pts.wt. of the sum of the total epoxy resin and the total phenol resin and the content of the hardening agent (D) is 0.4 to 20 pts.wt. based on 100 pts.wt. of the sum of the total epoxy resin and the total phenol resin.
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