TAPE/REEL-TYPED SEMICONDUCTOR CHIP SEALING EQUIPMENT

摘要

PURPOSE: A tape/reel-typed semiconductor chip sealing equipment is provided to stably guarantee a sealing state of a cover tape without causing abrupt thermal shock to the cover tape and a carrier tape. CONSTITUTION: A stage(101) is included in a main body. A carrier tape(4) having a plurality of pockets(5) is supplied to the stage. Semiconductor chips supplied from the exterior are contained inside the pockets. A pair of guide tracks(60) guides the state that the carrier tape is transferred, while being mounted in the stage. A cover tape(3) seals the pockets of the carrier tape moving along the guide track. An electric heating head(51) pressurizes both edges of the cover tape at a high temperature, and seals the cover tape on the carrier tape. A heater is built in the guide track.