发明名称 Process for fabricating double recess pseudomorphic high electron mobility transistor structures
摘要 The invention is a method for fabricating a pseudomorphic HEMT transistor structure with a semiconductor layer having a 2DEG layer therein, a Schottky layer, a transition layer, and an ohmic contact layer on the transition layer. A double recess structure is disposed through the ohmic layer into the transition layer in which one or two layers of INYGa1-YAs are used as etch-stop layers to define the depth of the recess(es).
申请公布号 US6242293(B1) 申请公布日期 2001.06.05
申请号 US19980193907 申请日期 1998.11.18
申请人 THE WHITAKER CORPORATION 发明人 DANZILIO DAVID
分类号 H01L21/285;H01L21/335;(IPC1-7):H01L21/338 主分类号 H01L21/285
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