Wafer holding head and wafer polishing apparatus, and method for manufacturing wafers

摘要

The present invention provides wafer polishing apparatus in which the wafer holding head comprises a diaphragm substantially vertically expanded to the head axis in the head body; a carrier, which is fixed to the diaphragm and provided so as to be able to displace along the head axis direction together with the diaphragm; a retainer fixed to the diaphragm in a concentric relation to the carrier; a pressure adjusting mechanism for controlling the pressure of a fluid chamber formed between the diaphragm and the head body; a plurality of carrier torque mechanisms provided between the head body and the carrier for communicating the torque of the head body to the carrier; a plurality of first sensors, which is provided at individual torque transfer mechanism, for observing the force along the direction of rotation acting on the wafer; and a processor, which is connected to each first sensor, for calculating the force acting on the wafer based on the output from these first sensors.