| 摘要 |
<p>PURPOSE: A wafer level package is provided to improve reliability of a solder junction of the package, by using a material having a low modulus of elasticity and electro-conductivity to reduce the stress concentrated on a bump. CONSTITUTION: A chip pad(52) is formed in a semiconductor chip(50). A lower insulating layer(54) is formed in the upper portion of the semiconductor device to expose the upper surface of the chip pad. A metal interconnection(56) is formed in the upper portion of the lower insulating layer so that one end of the metal interconnection is connected to the chip pad. An upper insulating layer(58) is formed in the upper portion of the metal interconnection to expose the upper surface of the other end of the metal interconnection. A buffer pad(60) is formed in the other end of the metal interconnection, and is made of a material of a low modulus of elasticity wherein the material has electro-conductivity. A bump(62) is made by adhering a solder ball to the buffer pad.</p> |
