| 摘要 |
PURPOSE: An integrated circuit socket for a ball grid array(BGA) is prevent a semiconductor integrated circuit from being damaged by fluidity, by settling the semiconductor integrated circuit in a settling part of a slide, and by making a protrusion part of a holder and a protrusion part of a holder coupled to each other to stably and precisely fix the integrated circuit. CONSTITUTION: A semiconductor integrated circuit is located in a predetermined position by a guide. The semiconductor integrated circuit is settled in a slide(90) by the guide. A holder(80) fixes the semiconductor integrated circuit to the slide. The holder has a pair of the first protrusion parts protruded to the exterior. The slide has a settling part for stable settling and the second protrusion part. The second protrusion part is coupled to the first protrusion part of the holder, capable of moving together with the first protrusion part.
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