| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide epoxy resin compositions which exhibit excellent flame retardance without containing a halogen compound and, at the same time, have improved heat resistance to soldering and other properties. SOLUTION: The epoxy resin compositions comprise a phosphorus compound having, on average, 1.8 to less than 3 phenolic hydroxyl groups having reactivity with an epoxy resin and, at the same time, on average, >=0.8 phosphorus element in the molecule, an inorganic filler having an average particle diameter of <=30μm, a difunctional epoxy resin having, on average, 1.8 to less than 2.6 epoxy groups in the molecule, and a curing agent as the essential components. In these epoxy resin compositions, the flame retardance and heat resistance to soldering can be ensured by incorporating the difunctional epoxy resin in an amount of 51 mass % based on the total epoxy resins, using dicyandiamide as the curing agent, and making the ratio a/c of the equivalent a of phenolic hydroxyl groups of the phosphorus compound to the equivalent b of epoxy groups of the difunctional epoxy resin 0.3 to less than 0.75.</p> |
