| 摘要 |
PURPOSE: Provided is a dry film photoresist using a biaxially oriented polyamide film as a protecting film, which can be used for a print wiring plate, a print circuit substrate, and a metal relief form. CONSTITUTION: The dry film photoresist is formed by laminating the protecting film layer, a photoresist layer, and a support layer in order, wherein the protecting film layer is the biaxially oriented polyamide film having a surface roughness of 5.0-50nm, a modulus of 100-200kg/mm¬2(23deg.C, 50 of relative humidity), and a contact angle against water of more than 80 degree. The biaxially oriented polyamide film is produced by adding 0.2-2.5wt. of ethylene bisstearamide to a polyamide resin and melting and extruding. |
