SINGULATION SYSTEM FOR SEPARATING SEMICONDUCTOR CHIP PACKAGE

摘要

PURPOSE: A singulation system for separating a semiconductor chip package is provided to improve productivity, by separating the singulation system into an on-loader part, a press part and an off-loader part to detach a chip package from a lead frame. CONSTITUTION: An on-loader unit(100) loads and transfers a magazine in which a plurality of lead frames are stacked. An index feeder unit(200) moves the respective lead frames transferred from the on-loader unit by one pitch. A press unit(300) separates a chip from the transferred lead frame. A working beam unit(400) transfers the chip separated from the press unit to the exterior of the press unit. Inspection equipment inspects the chip package transferred by the working beam unit. When a defect is found in the inspection, a reject transfer unit(500) exhausts the defective product to the exterior. An off-loader unit(600) transfers the semiconductor chip package passing the inspection and stacking the semiconductor chip package in a package tray.