| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject epoxy resin molding compound with slight variance in characteristics including moldability such as flowability, curability and releasability, adhesivity and mechanical properties at high temperatures such as flexural strength and flexural modulus, excellent in storage stability, and to provide an electronic part device equipped with elements sealed with the above epoxy resin molding compound. SOLUTION: This epoxy resin molding compound essentially comprises (A) an epoxy resin, (B) a curing agent, (C) a curing promoter and (D) 78-96 wt.% of an inorganic filler which is fused silica having the following characteristics: (a) average particle size is 1-30μm, (b) the fraction >=100μm in particle size accounts for <=0.1 wt.% of the whole filler, (c) for >=60 wt.% of the intermediate fraction except both the coarse and fine particle fractions, gives such a particle size distribution as to be 0.60-1.00 in the gradient n when plotted in a RRS particle size line diagram, (d) specific surface area is <=5 m2/g, and (e) silanol group concentration on the surface is <=1.5/nm2. The other objective electronic part device is such as to be equipped with elements sealed with the above epoxy resin molding compound.
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