发明名称 |
Producing method of a film-type transmission line and method of connecting to an existing line |
摘要 |
An exposed connecting portion is formed by partially removing a film substrate by such laser etching while leaving a transmission line pattern. A film-type transmission line is placed in such a manner as to overlap the exposed connecting portion and a transmission line pattern on a side to be connected. Bonding, for example thermo compression bonding, is applied to the two overlapped line patterns. Since a gold ribbon is not used and overlapping of a high-dielectric substrate and the film substrate is unnecessary, impedance irregularity is reduced. This makes it possible to carry out bonding without the medium of the film substrate and a connection with high reliability may be achieved.
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申请公布号 |
US6241143(B1) |
申请公布日期 |
2001.06.05 |
申请号 |
US19990393187 |
申请日期 |
1999.09.10 |
申请人 |
TOYOTA JIDOSHA KABUSHIKI KAISHA |
发明人 |
KURODA KAZUSHI |
分类号 |
H01P1/04;H01P3/02;H01P3/08;H01P5/02;H01P5/08;H01P11/00;H05K1/02;H05K3/36;(IPC1-7):B23K1/06;B23K31/10 |
主分类号 |
H01P1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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