| 摘要 |
PURPOSE: A semiconductor package is provided to improve cohesion between resin and a chip and to decrease moisture included in an adhesive material, by using a chip mounting plate of a radial structure in which a chip mounting area inside the semiconductor package is greatly reduced while the length of a tie bar is maintained. CONSTITUTION: A lead frame includes a chip mounting plate(14a) and a lead(24). A chip(16) is mounted on the chip mounting plate by an adhesive material(22). A wire(18) connects a bonding pad of the chip with the lead. Resin(20) molds the chip, the wire and the chip mounting plate. The chip mounting plate is fixed by a side rail and a tie bar of the lead frame. The chip mounting plate is composed of a connection frame to which the tie bar is connected and a plurality of bar-type chip mounting plates protruded toward the inside of the connection frame. |
