| 摘要 |
PURPOSE: A chemical mechanical polishing(CMP) apparatus having a plurality of polishing pads is provided to improve reliability of a CMP process, by simultaneously polishing a plurality of wafers by using the polishing pad while guaranteeing uniformity of the polishing process. CONSTITUTION: A plurality of polishing platens can rotate at a predetermined rate, disposed near each other and having the same horizontal level. A plurality of polishing pads(30a,30b,30c) are in contact with a wafer(42a,42b,42c) to polish a wafer, fixed to the upper portion of the polishing platens. A plurality of wafer transfer units moves the wafer over the polishing pads to uniformly polish the surface of the wafer while holding the wafer in contact with the polishing pad.
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