| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor-sealing epoxy resin composition, which can minimize the warpage of packages and has a good curability and a high adhesiveness. SOLUTION: The semiconductor-sealing epoxy resin composition comprises (A) a polyfunctional epoxy resin, (B) a phenolic resin, (C) an inorganic filler, and (D) thermoplastic resin fine particles having an average particle size of 0.1-50μm.
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