| 摘要 |
PURPOSE: A method for inspecting a semiconductor device is provided to precisely inspect a defect within a short interval of time and to reduce manufacturing cost even if lots of semiconductor objects are measured. CONSTITUTION: The inside of a semiconductor device is divided into a pad region, an inner lead region, an outer lead region, a tape region and a dimension region to distinguish a characteristic of an object to measure. One of red light, green light and blue light generated from a light source-generating unit is selected to inspect the respective regions. The object is enlarged to precisely irradiate the selected light source to the respective regions of the object. An imaging range of a scan head is changed to photograph a region caused by the image of the enlarged object.
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