METHOD FOR MANUFACTURING CONTACT HOLE OF SEMICONDUCTOR DEVICE

摘要

PURPOSE: A method for manufacturing a contact hole of a semiconductor device is provided to increase integration of a pattern and to reduce a bridge between adjacent contact holes, by performing a baking process at a high temperature regarding a contact hole formed through a mask pattern to form a circular contact hole. CONSTITUTION: A mask pattern is formed on a semiconductor substrate having a layer where a predetermined pattern is formed. An exposure process is performed regarding the mask pattern to form a contact hole. A baking process is performed at a high temperature regarding the semiconductor substrate having the contact hole to form a circular contact hole.