| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for peeling a molding by which a thin-layered molding can be easily peeled from a molding die. SOLUTION: There are provided a pair of platelike molding dies with a peelable layer set inside are spaced from each other and another molding die the peripheral parts of which are sealed to form a cavity. Next, a liquid resin is injected into the cavity using the mold parts and thus the liquid resin is cured to obtain a molding. After that, the molding die is opened and the molding adhering to the opened platelike mold parts through the peelable layer is peeled. In addition, this method for peeling the molding is characterized in that gas is blown into an interface between the molding on the adhesion side of the platelike mold part and the peelable layer or at least one or more interfaces between the peelable layers and the platelike mold parts at least from one direction of the thickness direction face of the peripheral end parts of the molding, the peelable layers and the platelike mold parts and thus, the molding is peeled from the platelike molding dies.
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