发明名称 |
METHOD FOR MANUFACTURING GREEN SHEET FOR LAMINATED ELECTRONIC COMPONENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a green sheet for a laminated electronic component capable of forming fine through holes by obtaining the sheet having the through hole at a low cost in a short time. SOLUTION: The protrusion forming surface of a molding member 1 having a protrusion 2 for forming a through hole is covered with the material of the slurry-like green sheet 4. The green sheet material covering the member 1 is dried and released from the member to obtain the green sheet 4 having the hole 6.
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申请公布号 |
JP2001150423(A) |
申请公布日期 |
2001.06.05 |
申请号 |
JP19990333277 |
申请日期 |
1999.11.24 |
申请人 |
TDK CORP |
发明人 |
SATO JUN |
分类号 |
H01F17/00;B28B1/14;B28B7/18;(IPC1-7):B28B7/18 |
主分类号 |
H01F17/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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