发明名称 METHOD FOR MANUFACTURING GREEN SHEET FOR LAMINATED ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a green sheet for a laminated electronic component capable of forming fine through holes by obtaining the sheet having the through hole at a low cost in a short time. SOLUTION: The protrusion forming surface of a molding member 1 having a protrusion 2 for forming a through hole is covered with the material of the slurry-like green sheet 4. The green sheet material covering the member 1 is dried and released from the member to obtain the green sheet 4 having the hole 6.
申请公布号 JP2001150423(A) 申请公布日期 2001.06.05
申请号 JP19990333277 申请日期 1999.11.24
申请人 TDK CORP 发明人 SATO JUN
分类号 H01F17/00;B28B1/14;B28B7/18;(IPC1-7):B28B7/18 主分类号 H01F17/00
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