| 摘要 |
A method and device for thermal creep-sizing an annular-shaped structure. The creep-sizing device includes a ring member with through-holes present between the inner and outer diametrical boundaries of the ring member, and with through-slots alternatingly extending from each through-hole to either the inner or outer diametrical boundary. In use, the ring member is placed within the annular-shaped structure, and pins are installed in the through-holes in the ring member to cause the outer diametrical boundary of the ring member to diametrically expand. The structure and creep-sizing device are then heated so that the mechanically expanded ring member causes the structure to undergo thermal creep-sizing.
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