STRUCTURE AND METHOD FOR LEAD FRAME AND SEMICONDUCTOR PACKAGE USING THE SAME

摘要

PURPOSE: A method for manufacturing a lead frame is provided to reduce a mounting area of a semiconductor package on a mother board and decrease an electrical path of the semiconductor chip, by forming a lead frame in which the ends of leads are bent to overlap each other so that the bend overlap portion is exposed to the exterior. CONSTITUTION: A lead frame material(50) to be a lead frame is punched to form a penetration hole. The peripheral portion of the penetration hole is separately punched to form a lead(30). End portions of a plurality of the leads are simultaneously bent and overlapped to form an overlap portion(32).