发明名称 METHOD FOR STICKING FINE ON SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a method for sticking a film on substrates in which substrates are continuously conveyed while treating an interval between substrates under a condition of temporarily stopping the feed of the film, a continuous sticking of the substrate to the film is carried out and the number of processed substrates per unit time is increased. SOLUTION: This method for sticking a film is to pass a plurality of sheets of substrates which are conveyed on a conveying route which maintaining a desired interval and the film which is fed from a wound roll and is applied by the treatment of an interval between substrates on parts corresponding to the interval between substrates between pressure rollers installed on the middle of the conveying route to stick the adhesive face of the film on each of the substrates. While continuously conveying a plurality of substrates on the conveying route, the feed of the film is intermittently and temporarily stopped and the treatment of an interval between substrates is performed, and after that the quantity fed of the film is stored by the rotation of a suction roller which leads to the relative displacement of suction zoned. The stored film and a plurality of substrates are continuously fed between the pressure rollers to continuously stick the film on the substrates.
申请公布号 JP2001152098(A) 申请公布日期 2001.06.05
申请号 JP19990336241 申请日期 1999.11.26
申请人 HITACHI TECHNO ENG CO LTD 发明人 TAKEDA TOSHIHIKO;HAYASHI TAKEHIKO
分类号 C09J5/00;(IPC1-7):C09J5/00 主分类号 C09J5/00
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