MATERIAL FOR MANUFACTURING SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A material for manufacturing a semiconductor package is provided to supply resin in a plurality of package regions in a molding process and to easily discharge static electricity generated in the molding process, by forming the material of a matrix format. CONSTITUTION: A conductive pattern is formed on the surface of a resin layer(22). A cover coat(18) is applied on the resin layer including the conductive pattern. A semiconductor package region(22) is composed of the resin layer and the cover coat, having a symmetrical matrix disposition. The center portion of a metal layer(16) for ground is connected to the conductive pattern in the periphery. The metal layer for ground functions as a resin supplying port. A gate(12) functioning as a path for supplying resin is formed between the metal layer for ground and the semiconductor package region.