| 摘要 |
PROBLEM TO BE SOLVED: To provide a film for flexible print wiring exhibiting very firm adhesion between a polyimide film as a substrate and a copper thin film and formation of a fine pattern by etching. SOLUTION: The film for flexible print wiring is obtained by subjecting at least one side of the polyimide film containing 0.01-2 wt.%, based on the film, of aluminum oxide or silicon dioxide in the film to a plasma treatment, forming thereon a copper thin film having a film thickness of 50-5,000 nm by an ion-plating method by a pressure gradient type discharge and further forming on the copper thin film a film of copper by an electrolytic plating method. |
