| 摘要 |
PROBLEM TO BE SOLVED: To obtain a printed wiring board of high quality generating no smear to decrease a burr further with small roughness in a perforated wall. SOLUTION: A thermoplastic resin film of multi-layer structure, constituting a thermoplastic resin layer containing no skid outside a thermoplastic resin layer containing a skid, and metal foil are fixed together to obtain a sheet, and the sheet is overlapped with a printed wiring board to perforate it.
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