| 摘要 |
A method for manufacturing an electronic device includes placing a plurality of components on a printed wiring board (204), detecting a defect in a component (210) and, in response, producing a defect indication including a defect location on the printed wiring board. Subsequently, additional components are placed on the printed wiring board (220) but placement of all additional components having a location which has a predetermined relation with the defect location is suspended. The defective printed wiring board may then be repaired by a technician who subsequently places the additional components over the defect location. This reduces the need to apply a large amount of heat to the printed wiring board to remove subsequently placed components such as radio frequency shields. This further reduces the possibility of additional defects occurring during repair.
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