发明名称 |
Integrated edge exposure and hot/cool plate for a wafer track system |
摘要 |
There is provided an improved resist coating/developing processing method and apparatus for a wafer track system so as to increase its throughput. In a preferred embodiment, this is achieved by integrating a wafer edge exposure unit with a temperature control plate unit into a single integrated processing unit having the functionality of the two separate processing units.
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申请公布号 |
US6240874(B1) |
申请公布日期 |
2001.06.05 |
申请号 |
US19990320685 |
申请日期 |
1999.05.27 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
PIKE CHRISTOPHER L. |
分类号 |
G03F7/20;G03F7/30;H01L21/00;(IPC1-7):B05C11/00;B05C9/14;B05C11/08;B05D3/06 |
主分类号 |
G03F7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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