发明名称 |
Method for electroplating a film onto a substrate |
摘要 |
A method for electroplating a film onto a substrate. Electrical power is supplied to the plating surface through electrical contact made to contact pads on the underside of the substrate. Contact to the contact pads is made within a liquid-tight region. The contact pads are connected to the plating surface through the substrate. Because the contact scheme is provided within a liquid-tight region on the underside of the substrate, the contacts do not erode or become plated, nor do they consume an area of the plating surface. |
申请公布号 |
US6241868(B1) |
申请公布日期 |
2001.06.05 |
申请号 |
US20000541018 |
申请日期 |
2000.03.31 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BIGGS GLEN N.;BREWER DONALD M.;FLUEGEL JAMES E.;KAJA SURYANARAYANA;MALHOTRA ASHWANI K.;PALMATIER PHILLIP W. |
分类号 |
C25D7/12;C25D17/00;H05K3/24;(IPC1-7):C25D5/02 |
主分类号 |
C25D7/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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