| 摘要 |
PROBLEM TO BE SOLVED: To provide a slurry supplying device capable of preventing slurry from being aggregated and capable of restraining a polishing flaw from being generated. SOLUTION: A slurry circulating line 2 for circulating slurry is connected to an inlet and an outlet of a slurry supplying unit 1 for supplying slurry. Slurry in the circulating line 2 is circularly driven by a pump 6, and an ultrasonic oscillator 3 for radiating ultrasonic waves to the slurry is connected to the circulating line 2. Therefore, when the ultrasonic waves are radiated to the slurry in the circulating line 2, binding of large aggregated grains is released, and slurry grains are made fine grains. The slurry containing the fine grains is filtered by a filter 4 and then supplied to a CMP device 5. |
