CIRCUMFERENCE PROCESSING METHOD AND PROCESSING DEVICE FOR THIN DISC

摘要

PROBLEM TO BE SOLVED: To provide a processing method and a processing device capable of finishing a circumference portion of a thin disc at a high efficiency and a high quality by a fixed grinding grain processing tool. SOLUTION: In a finishing processing of a circumference portion of a thin disc, an outer periphery portion is processed with a grinding wheel 3 by a grinding device 10 and a notch portion on the outer periphery is processed with a polishing film 1 by a film polishing device 30. A grinding grain (silica grinding grain, barium carbonate grinding grain or cerium oxide grinding grain) causing a mechanochemical action is used for the grinding wheel 3 and the polishing film 1. A primary grain average grain diameter of the grinding grain is 0.8μm-10μm.