| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor which shows excellent fire retarding property without a halogen-based fire retarding agent and an antimony compound. SOLUTION: An epoxy resin composition for sealing a semiconductor contains (A) an epoxy resin having a pyrene structure represented by the formula (1), (B) a phenol resin, (C) a hardening agent and (D) an inorganic filler each as an essential component, wherein the content of (D) the inorganic filler is 70 to 94 wt.% based on the total epoxy resin composition and the content of the carbon atom of the pyrene structure represented by the formula (1) is 10 to 85 wt.% based on all the carbon atoms of the epoxy resin having the pyrene structure represented by the formula (1).
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