| 摘要 |
PROBLEM TO BE SOLVED: To provide a film deposition apparatus capable of simultaneously depositing films both on the front and back sides of an dielectric substrate. SOLUTION: A substrate is arranged inside a cylinder of a cylindrical electrode 14 so as to direct front and back sides of the substrate S toward an opening part 14a of the cylindrical electrode 14, a RF bias voltage or a pulse bias voltage is applied, thus, applying of a bias voltage to an insulative substrate S is made possible. Further, both the front and back sides of the substrate S is arranged so as to direct toward an opening part 14a of the cylindrical electrode 14, ECR plasma P is guided to both front/back faces of the substrate S, a protective film is simultaneously deposited on both the front and back sides of the substrate S.
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